Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

High-density electronic packages have increased with the development of nanotechnology. Electric circuits have also become significantly smaller because of the high accuracy micro-/nano-wiring pattern ...

BGA’s are the boon and bane of engineers and printed circuit board designers. Their unparalleled pin density and low lead inductance are essential in today’s high-pin count, high-frequency integrated ...

State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes. We report here on the development and testing of a new architecture ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

The following paper provides Via Fanout and Trace Routing solutions for various metric pitch Ball Grid Array Packages. Note: the “metric” dimensions are the ruling numbers. To solve the metric pitch ...